Bismuth-antimony as an alternative material for high temperature lead-free solder
The development works on high temperature lead free solder are mostly discussed nowadays. To replace the current high temperature lead free solders it would be the great problem. To become a viable high temperature lead free solder alternative for electronics assembly use, it is considered essential...
Saved in:
Main Author: | Muhamad Zam, Shahrul Fadzli |
---|---|
Format: | Thesis |
Language: | English |
Published: |
2012
|
Online Access: | http://psasir.upm.edu.my/id/eprint/34035/1/FK%202012%205R.pdf http://psasir.upm.edu.my/id/eprint/34035/ |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Bismuth-argentum alloys as alternative high temperature lead-free solder
by: Rosilli, Rohaizuan
Published: (2012) -
Bi-Ag as an alternative high temperature solder
by: Rosilli, Rohaizuan, et al.
Published: (2014) -
Corrosion study of Stanum-Bismuth-Copper Lead-free solder in acidic solution
by: Samsudin, Rabiatul Adawiyah
Published: (2019) -
Characterisation of Antimony and Antimony-Bismuth Oxides Synthesised By Precipitation Technique.
by: Mohd Noor, Norhayati
Published: (2007) -
Solder joint strength of lead free solders under multiple reflow and high temperature storage condition
by: Ahmad, I., et al.
Published: (2017)