Development of high-temperature lead-free solder for semiconductor chip attachment / Ashraful Haque

• Main Author: Ashraful, Haque
• Format: Thesis
• Published: 2011
• Subjects: T Technology (General); TJ Mechanical engineering and machinery
• Online Access: http://studentsrepo.um.edu.my/7997/6/Dissertation_Ashraful_Haque_(KGA080071).pdf; http://studentsrepo.um.edu.my/7997/

Lead (Pb)-free electronic product is a catchphrase of consumer and different regulators worldwide which turns in to an obligatory for the electronic industries to remove Pb from semiconductor assembly for the reason that it is highly toxic, harmful for human health and environment. Alternative as...