The effects of high temperature storage on lead free solder joint material strength using pull test method
The purpose of this study is to discuss on the effect of high temperature storage (HTS) on lead free solder joint material for ball grid array application using pull test method. Three samples of different lead free solder joint material were choosed in this experiment that are Sn3.8Ag0.7Cu (SA C387...
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| 主要な著者: | , , |
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2017
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| オンライン･アクセス: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5301 |
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