A Review: Lead Free Solder and Its Wettability Properties
The purpose of this paper is to publish on the review of the lead free solder for electronic packaging. This involved the basic principles of the solder, the lead solder and its legislation and the lead free solder with its mechanism. In addition, this paper also reviews on the lead free solder char...
保存先:
| 主要な著者: | , , |
|---|---|
| フォーマット: | 論文 |
| 言語: | English |
| 出版事項: |
Emerald Group Publishing Limited
2016
|
| 主題: | |
| オンライン･アクセス: | http://umpir.ump.edu.my/id/eprint/13901/1/fkm-2016-aisha-Review%20lead%20free.pdf http://umpir.ump.edu.my/id/eprint/13901/ http://dx.doi.org/10.1108/SSMT-08-2015-0022 |
| タグ: |
タグ追加
タグなし, このレコードへの初めてのタグを付けませんか!
|