A comparative study of Sn3.5Ag and Sn3.8Ag0.7Cu for BGA spheres on Ni/Au finish

• Main Authors: Eu, P.-L., Ding, M., Hoh, H.-J., Rayos, J., Su, P., Lindsay, W., Chopin, S., Ahmad, I.
• Published: 2017
• Online Access: http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5294

A comparative study was conducted with Sn3.5%Ag and Sn3.8%Ag0.7%Cu solder balls on Ball Grid Array (BGA) packages with Ni/Au pad finishing. The study was carried out in different levels. At individual solder joint level, Sn3.5Ag showed no intermetallic brittle failure in cold ball pull test under an...