Reduction of warpage occurrence on stack-die QFN using FEA and statistical method
Warpage is greatly affected by package geometries, such as dimension of matrix array, pad, die and passive components as well as molding compound properties. It is also related to thermal mismatch i.e. coefficient of thermal expansion (CTE) and reliability of passive components in the package. So in...
Saved in:
| Main Authors: | , , , |
|---|---|
| Format: | |
| Published: |
2017
|
| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5265 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|