Dicing laminated wafer for QFN 3D stacked die packaging
Nowadays, die attach film (DAF) gaining popularity in microelectronic packaging as integral part in facilitating the growth of wafer level packaging and stacked die packaging. DAF applied to the backside of wafers prior to saw have many advantages, such as the elimination of the epoxy dispensed proc...
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| Main Authors: | , , , , |
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2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5284 |
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