Reduction of warpage occurrence on stack-die QFN using FEA and statistical method

• Main Authors: Abdullah, I., Ahmad, I., Talib, M.Z.M., Kamarudin, M.N.B.C.
• Published: 2017
• Online Access: http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5265

Warpage is greatly affected by package geometries, such as dimension of matrix array, pad, die and passive components as well as molding compound properties. It is also related to thermal mismatch i.e. coefficient of thermal expansion (CTE) and reliability of passive components in the package. So in...