Thermal Management In Stacked Dies
The present trend in integrated circuit (IC) packaging, geared towards reduction in size and higher functionality in IC packages, has called about the need for integrating dies vertically in a single package. Added functionality and capacity of stacked dies packages within the same footprint a...
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| Format: | Monograph |
| Language: | English |
| Published: |
Universiti Sains Malaysia
2005
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| Online Access: | http://eprints.usm.my/58206/1/Thermal%20Management%20In%20Stacked%20Dies_Norman%20Hua%20Shijie.pdf http://eprints.usm.my/58206/ |
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