Improvement of Cu-Al bond integrity on low k pad structures
Gold wires are commonly used for wire-bonding and it fits well the industrial requirements. However, the price of Gold wires increasing significantly, Copper wires is a potential replacement for Gold due to their superior electrical and mechanical properties. In order to incorporate Cu in the wire-b...
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| Main Authors: | , , , , |
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| Format: | Conference paper |
| Published: |
2023
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