Electrical properties and thermal stability of Cu-P containing electrically conductive adhesives
Organized by School of Materials Engineering & Sustainable Engineering Research Cluster, 1st - 2nd December 2009 at Putra Brasmana Hotel, Kuala Perlis, Perlis.
Saved in:
Main Authors: | Li-Ngee, Ho, Hiroshi, Nishikawa, Tadashi, Takemoto |
---|---|
Other Authors: | holingee@yahoo.com |
Format: | Working Paper |
Language: | English |
Published: |
Universiti Malaysia Perlis
2010
|
Subjects: | |
Online Access: | http://dspace.unimap.edu.my/xmlui/handle/123456789/7530 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Effect of different copper fillers on the electrical resistivity of conductive adhesives
by: Li-Ngee, Ho, et al.
Published: (2011) -
Electrical properties of pre-alloyed Cu-P containing electrically conductive adhesive
by: Ho, Li Ngee, et al.
Published: (2010) -
Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives
by: Ho, Li Ngee, Dr., et al.
Published: (2014) -
Surfactant-free synthesis of copper particles for electrically conductive adhesive applications
by: Ho, Li Ngee, et al.
Published: (2013) -
Copper-filled electrically conductive adhesives with enhanced shear strength
by: Ho, Li Ngee, Dr., et al.
Published: (2015)