Electrical properties and thermal stability of Cu-P containing electrically conductive adhesives

Organized by School of Materials Engineering & Sustainable Engineering Research Cluster, 1st - 2nd December 2009 at Putra Brasmana Hotel, Kuala Perlis, Perlis.

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Bibliographic Details
Main Authors: Li-Ngee, Ho, Hiroshi, Nishikawa, Tadashi, Takemoto
Other Authors: holingee@yahoo.com
Format: Working Paper
Language:English
Published: Universiti Malaysia Perlis 2010
Subjects:
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/7530
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