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Electrical properties and thermal stability of Cu-P containing electrically conductive adhesives

Organized by School of Materials Engineering & Sustainable Engineering Research Cluster, 1st - 2nd December 2009 at Putra Brasmana Hotel, Kuala Perlis, Perlis.

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Bibliographic Details
Main Authors: Li-Ngee, Ho, Hiroshi, Nishikawa, Tadashi, Takemoto
Other Authors: holingee@yahoo.com
Format: Working Paper
Language:English
Published: Universiti Malaysia Perlis 2010
Subjects:
Conductive adhesive
Copper
Aging
Electrical properties
Metallic fillers
Solders
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/7530
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spelling my.unimap-75302010-01-20T03:41:50Z Electrical properties and thermal stability of Cu-P containing electrically conductive adhesives Li-Ngee, Ho Hiroshi, Nishikawa Tadashi, Takemoto holingee@yahoo.com Conductive adhesive Copper Aging Electrical properties Metallic fillers Solders Organized by School of Materials Engineering & Sustainable Engineering Research Cluster, 1st - 2nd December 2009 at Putra Brasmana Hotel, Kuala Perlis, Perlis. Electrically conductive adhesives (ECA) containing Cu-P and Cu as metallic filler, respectively, were studied in term of electrical properties and thermal stability. Both metallic fillers used in this study were prepared by using gas atomization method. The electrical property of the Cu-P filled ECA was investigated for long-term stability and reliability by aging at high temperature exposure at 125°C for 1000 h. Results showed that the Cu-P filled ECA remained consistently low electrical resistivity after 1000 h aging at 125°C, compared to that of the Cu filled ECA where the electrical resistivity increased rapidly over time. 2010-01-20T03:41:10Z 2010-01-20T03:41:10Z 2009-12-01 Working Paper p.1-4 http://hdl.handle.net/123456789/7530 en Proceedings of the Malaysian Metallurgical Conference '09 (MMC'09) Universiti Malaysia Perlis
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Conductive adhesive
Copper
Aging
Electrical properties
Metallic fillers
Solders
spellingShingle Conductive adhesive
Copper
Aging
Electrical properties
Metallic fillers
Solders
Li-Ngee, Ho
Hiroshi, Nishikawa
Tadashi, Takemoto
Electrical properties and thermal stability of Cu-P containing electrically conductive adhesives
description Organized by School of Materials Engineering & Sustainable Engineering Research Cluster, 1st - 2nd December 2009 at Putra Brasmana Hotel, Kuala Perlis, Perlis.
author2 holingee@yahoo.com
author_facet holingee@yahoo.com
Li-Ngee, Ho
Hiroshi, Nishikawa
Tadashi, Takemoto
format Working Paper
author Li-Ngee, Ho
Hiroshi, Nishikawa
Tadashi, Takemoto
author_sort Li-Ngee, Ho
title Electrical properties and thermal stability of Cu-P containing electrically conductive adhesives
title_short Electrical properties and thermal stability of Cu-P containing electrically conductive adhesives
title_full Electrical properties and thermal stability of Cu-P containing electrically conductive adhesives
title_fullStr Electrical properties and thermal stability of Cu-P containing electrically conductive adhesives
title_full_unstemmed Electrical properties and thermal stability of Cu-P containing electrically conductive adhesives
title_sort electrical properties and thermal stability of cu-p containing electrically conductive adhesives
publisher Universiti Malaysia Perlis
publishDate 2010
url http://dspace.unimap.edu.my/xmlui/handle/123456789/7530
_version_ 1643788863114575872
score 13.222552

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