Electrical properties and thermal stability of Cu-P containing electrically conductive adhesives

• Main Authors: Li-Ngee, Ho, Hiroshi, Nishikawa, Tadashi, Takemoto
• Other Authors: [e-mail]
• Format: Working Paper
• Language: English
• Published: Universiti Malaysia Perlis 2010
• Subjects: Conductive adhesive; Copper; Aging; Electrical properties; Metallic fillers; Solders
• Online Access: http://dspace.unimap.edu.my/xmlui/handle/123456789/7530

Organized by School of Materials Engineering & Sustainable Engineering Research Cluster, 1st - 2nd December 2009 at Putra Brasmana Hotel, Kuala Perlis, Perlis.