封面图片

Study on the effect of Ca content in 4n Gold Wire for Qfn Stacked Die Package

Organized by School of Materials Engineering & Sustainable Engineering Research Cluster, 1st - 2nd December 2009 at Putra Brasmana Hotel, Kuala Perlis, Perlis.

Saved in:

书目详细资料
Main Authors:	Azman, Jalar, Saidatul Azura, Radzi, M.A. A., Hamid
格式:	Working Paper
语言:	English
出版:	Universiti Malaysia Perlis 2010
主题:	Wire bonding Ultrasonic (USG) current QFN packaging Ball bonding Bonding material Semiconductor engineering
在线阅读:	http://dspace.unimap.edu.my/xmlui/handle/123456789/7480
标签:	添加标签没有标签, 成为第一个标记此记录!

相似书籍

Extended reliability of gold and copper ball bonds in microelectronic packaging
由: Chong, Leong Gan, et al.
出版: (2014)

Characterization of Intermetallic Growth in Gold Ballbonds on Aluminum Metallization
由: Lim Moy Fung
出版: (2008)

Surface roughness and adhesion analysis study on ultrasonic gold ball onto aluminium bond pad
由: Vithyacharan, Retnasamy
出版: (2014)

Development of insulated Cu wire ball bonding
由: Leong H.Y., et al.
出版: (2023)

Wire bond shear test simulation on hemispherical surface bond pad
由: Zaliman, Sauli, Dr., et al.
出版: (2014)

Wire bond shear test simulation
由: Vairavan, Rajendaran, et al.
出版: (2013)

Process optimization approach in fine pitch Cu wire bonding
由: Wong B.K., et al.
出版: (2023)

Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging
由: Chong, Leong Gan, et al.
出版: (2014)

Metallurgical bond integrity of C45 ultra fine pitch with 18m copper wire
由: Kid W.B., et al.
出版: (2023)

Ultra fine pitch Cu wire bonding on C45 ultra low k wafer technology
由: Leng E.P., et al.
出版: (2023)

Characterization of intermetallic growth of gold ball bonds on aluminum bond pads
由: Mohd Khairuddin, Md Arshad, et al.
出版: (2009)

Assessment on the ASEAN standards to support sustainable and responsible investments (SRIs) and green bonds / Muhammad Zarunnaim Wahab and Asmadi Mohamed Naim
由: Wahab, Muhammad Zarunnaim, et al.
出版: (2021)

Market reactions to the announcement of sukuk: evidence from Malaysian market / Muzrifah Mohamed Mohamed
由: Mohamed, Muzrifah Mohamed
出版: (2014)

Determinant of bond market in Malaysia / Shamsul Arif Zulfikar Husni
由: Zulfikar Husni, Shamsul Arif
出版: (2022)

The determinants that affect government bond yield in Malaysia / Natasha Zulkifli
由: Zulkifli, Natasha
出版: (2022)

The factors affecting sukuk issuance among firms in Malaysia / Syazmel Areef Abd Aziz
由: Abd Aziz, Syazmel Areef
出版: (2022)

Corporate bond as a source of finance for technology companies in emerging economies / Wishal Iman Amalia Razali
由: Razali, Wishal Iman Amalia
出版: (2022)

Research trends on contracts, structures, pricing, and grading of Sukuk: A bibliometric analysis / Siti Nurul Ain Ghazali
由: Ghazali, Siti Nurul Ain
出版: (2022)

Wire bond shear test simulation on sharp groove surface bond pad
由: Zaliman, Sauli, Dr., et al.
出版: (2014)

C45 ultra low k wafer technology with Cu wire bonding
由: Leng E.P., et al.
出版: (2023)

Rate cut may not save ringgit bond rally as index outflow looms
由: Anon
出版: (2020)

Factor influencing yields of Malaysian government bond / Nurul Atiqah Ahmad Tajuddin
由: Ahmad Tajuddin, Nurul Atiqah
出版: (2015)

The relationship between government bond yields with selected macroeconomic variables / Muhammad Ariff Iskandar Harun
由: Harun, Muhammad Ariff Iskandar
出版: (2016)

Foreign holding of local currency govt bonds in select Asian economics
由: AsianBondsOnline, et al.
出版: (2015)

Thermal aging study at 150 °C and 200 °C: Gold ball bonds to aluminum bond pad
由: Mohd Khairuddin, Md Arshad, et al.
出版: (2010)

Thermal-mechanical analysis of bonding pad in insulated gate bipolar transistor
由: Ong, Chiew Yeong
出版: (2018)

Electronic structure, density of electronic states, and the chemical bonding properties of 2,4-dihydroxyl hydrazone crystals (C13H 11N3O4)
由: Ali Hussain, Reshak, Prof. Dr., et al.
出版: (2014)

Strength of ductile adhesive butt joint bonded with dissimilar adherents: effect of surface roughness
由: Nurul Atikah, et al.
出版: (2014)

الصكوك الإسلامية ضوابطها ودورها في الاستثمار وتطبيقها في ماليزيا (هيئة الأوراق المالية نموذجا)
由: Issahaku Abdullah
出版: (2019)

Factor that affect the performance of Sukuk in Indonesia / Alif Akbar
由: Akbar, Alif
出版: (2021)

Ciri Kenyal dan Rawat Haba Bagi Kaca Argentum Borat dan Fosfat
由: Mohamed Kamari, Halimah
出版: (2001)

The factor that affect the performance of sukuk in Malaysia / Syafafah Mohd Fakiri
由: Mohd Fakiri, Syafafah
出版: (2022)

Electronic structure, chemical bonding features, and electron charge density of the double-cubane single crystal [Sb7S8 Br 2] (AlCl4)3
由: Ali Hussain, Reshak, Prof. Dr., et al.
出版: (2011)

Total Danajamin guaranteed bonds issued as of April 12
由: Danajamin
出版: (2014)

M'sia bonds back in favour
由: Anon
出版: (2018)

Experimental and SPH study of cold spray impact between similar and dissimilar metals
由: Manap, A., et al.
出版: (2017)

A study on the macroeconomic variables that affects the price of Islamic bond (SUKUK) in Malaysian bond market / Siti Diana Atira Zulkifly
由: Zulkifly, Siti Diana Atira
出版: (2015)

A study on factors that effect bond price volatility in Malaysia bond market / Nur Hafsah Dan
由: Dan, Nur Hafsah
出版: (2011)

Reduction of warpage occurrence on stack-die QFN using FEA and statistical method
由: Abdullah I., et al.
出版: (2023)

Bonding strength characteristics of FA-based geopolymer paste as a repair material when applied on OPC substrate
由: Warid Wazien, Ahmad Zailani, et al.
出版: (2020)