Thermal aging study at 150 °C and 200 °C: Gold ball bonds to aluminum bond pad

• Main Authors: Mohd Khairuddin, Md Arshad, Lim, Moy Fung, Uda, Hashim, Zaliman, Sauli
• 格式: Article
• 語言: English
• 出版: The Electrochemical Society 2010
• 主題: Intermetallic growth; Thermal aging; Wire bonding; Field emission; Semiconductor materials; Aluminum; Light metals
• 在線閱讀: http://dspace.unimap.edu.my/xmlui/handle/123456789/7463

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