封面圖片

The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering

Link to publisher's homepage at https://www.sciencedirect.com/

Saved in:

書目詳細資料
Main Authors:	‪Mohd Izrul Izwan, Ramli‬, Mohd Arif Anuar, Mohd Salleh, H., Yasuda, J., Chaiprapa, K., Nogita
其他作者:	mohdizrulizwan@gmail.com
格式:	Article
語言:	English
出版:	Elsevier 2020
主題:	Soldering Solder Interconnects Intermetallics Solid solution Microstructure Solder properties
在線閱讀:	http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68724
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

相似書籍

Effect of isothermal aging to the intermetallic compound (IMC) growth of Sn-0.7Cu-1.0Si₃N₄ composite solder on copper substrate
由: Najib Saedi, Ibrahim
出版: (2016)

Effect of Zinc additions on Sn-0.7Cu-0.05Ni lead free solder alloy
由: Nurul Ashikin, Saleh
出版: (2022)

Development of Lead-Free Sn-0.7Cu-Si3N4 composite solders
由: Muhammad Hafiz, Zan @ Hazizi
出版: (2016)

A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods
由: Mohd Arif Anuar, Mohd Salleh, et al.
出版: (2014)

Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad
由: Mayappan, Ramani, et al.
出版: (2010)

Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route
由: Norhayanti, Mohd Nasir
出版: (2017)

Effect of current stressing on intermetallic formation and mechanical properties of lead free SAC solder and SAC/activated carbon composite solder joint
由: Syahirah Alyaa, Yahya
出版: (2017)

Performance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing
由: Mohd Arif Anuar, Mohd Salleh, et al.
出版: (2022)

The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement
由: Mohd Izrul Izwan, Ramli
出版: (2016)

Fabrication and characterization of hybrid microwave assisted sintering Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder
由: Flora, Somidin
出版: (2019)

Hot air solder levelling (HASL) process parameters optimization for SN100CL
由: Fatin Afeeqa, Mohd Sobri
出版: (2016)

Development od SiC reinforced SnCu and SAC based lead-free solder composite via powder metallurgy route
由: Zawawi, Mahim
出版: (2018)

Aging effect of Sn-Ag-Cu lead free solder
由: Mohd Jeffry, Radzi
出版: (2009)

Synthesis and characterization of lead free SnCu & SnCu/SiC composite solder
由: Nur Syahirah, Mohamad Zaini
出版: (2022)

Interfacial analysis of carbon nanotubes-reinforced and graphene-reinforced Sn-1.0Ag-0.5Cu solder on electroless nickel/ immersion silver surface finish
由: Krishna, Vidyatharran
出版: (2020)

Research development of solder materials and its intermetallic compound (IMC) study
由: Mohd Arif Anuar, Mohd Salleh, et al.
出版: (2014)

Research development of solder materials and its intermetallic compound (IMC) study
由: Mohd Arif Anuar, Mohd Salleh, et al.
出版: (2014)

Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
由: Mohd Izrul Izwan, Ramli, et al.
出版: (2020)

Wettability and shear strength of Sn-Cu-Ni-xSi3N4 composite solder
由: Mohd Izrul, Izwan Ramli, et al.
出版: (2019)

Study the effect of isothermal aging on Sn-Ag-Cu (SAC) lead-free solder added with silicon carbide (SiC)
由: Nisrin, Adli
出版: (2017)

Microstructure and mechanical propeties of new leadfree SAC and activated carbon composite solder
由: Ahmad Akhyar, Zulkarnain
出版: (2017)

The Sn-3.5Ag-1.0Cu-0.1Zn/Cu intermetallic interface under thermal aging / Iziana Yahya, Hamidi Abd Hamid and Ramani Mayappan
由: Yahya, Iziana, et al.
出版: (2012)

Intermetallic Compound (IMC) Analysis by Using Isothermal Aging Testing on Lead Free Solder
由: L.Chee Ping, Azrina A., et al.
出版: (2013)

To obtain the optimum parameters for welding of copper and aluminum using friction welding technique / Mcdawson Dewk
由: Dewk, Mcdawson
出版: (2010)

Isothermal aging affect to the growth of Sn-Cu-Ni-1 wt. % TiO2 composite solder paste
由: Rita, Mohd Said, et al.
出版: (2019)

Effect of corrosion in acidic solution to the phase and microstructure of SN-CU solder
由: Gan, Zhi Wan
出版: (2017)

Study of welding on aluminum alloy 5083 / Mohd Noor Ariff Muhammad and Mohamad Nor Azuan Mohamad
由: Muhammad, Mohd Noor Ariff, et al.
出版: (2002)

Influence of kaolin geopolymer ceramic additions to the wettability and electrical properties of Sn-3.0Ag-0.5Cu (SAC305) lead free solder
由: Mohd Arif Anuar, Mohd Salleh, et al.
出版: (2022)

Zn-Sn based high temperature solder - A short review
由: Sayyidah Amnah, Musa, et al.
出版: (2014)

Computerisation of trouble shooting in welding / Ahmad Asfanizam Mohamad and Mohd. Taufik Yusof
由: Mohamad, Ahmad Asfanizam, et al.
出版: (1998)

Nickel (Ni) microalloying additions in Sn-Cu lead-free solder. short review
由: Mohd Arif Anuar, Mohd Salleh, et al.
出版: (2022)

Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique
由: Sayyidah Amnah, Musa
出版: (2015)

Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review
由: Mohd Arif Anuar, Mohd Salleh, et al.
出版: (2014)

Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder
由: Flora Somidin, et al.
出版: (2014)

The effect of corrosion in acidic solution to the phase and microstructure of SAC305 solder
由: Khoo, Cheng Hao
出版: (2017)

Research advances of composite solder material fabricated via powder metallurgy route
由: Mohd Arif Anuar, Mohd Salleh, et al.
出版: (2014)

Thermal properties of Sn-0.7Cu/re-Al composite lead-free solder
由: Mohd Arif Anuar, Mohd Salleh, et al.
出版: (2014)

Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder
由: Mohd Arif Anuar, Mohd Salleh, et al.
出版: (2013)

Wettability, electrical and mechanical properties of 99.3Sn-0.7Cu/Si 3N4 novel lead-free nanocomposite solder
由: Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr., et al.
出版: (2011)

An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite
由: Norainiza, Saud, et al.
出版: (2020)