The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering
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2020
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my.unimap-687242020-11-13T03:44:05Z The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering Mohd Izrul Izwan, Ramli Mohd Arif Anuar, Mohd Salleh H., Yasuda J., Chaiprapa K., Nogita mohdizrulizwan@gmail.com arifanuar@unimap.edu.my yasuda.hideyuki.6s@kyoto-u.ac.jp jitrin@slri.or.th k.nogita@uq.edu.au Soldering Solder Interconnects Intermetallics Solid solution Microstructure Solder properties Link to publisher's homepage at https://www.sciencedirect.com/ This paper elucidated the effects of the Bi element (0 wt%, 0.5 wt% and 1.5 wt%) on the microstructure, electrical, wettability and mechanical properties of the Sn-0.7Cu-0.05Ni as a high strength solder. Besides using the conventional cross-sectioned microstructure image, the real-time synchrotron radiation imaging and synchrotron micro-X-ray fluorescence (XRF) technique was also used to investigate the microstructure, focusing on the in-situ growth behaviour of the primary (Cu,Ni)6Sn5 intermetallic and elemental distribution that had occurred in the Sn-0.7Cu-0.05Ni-1.5Bi. Other essential properties of solder material, such as wettability, electrical resistance, and shear strength, were also determined. The results showed that the addition of 1.5 wt% Bi refined the primary (Cu,Ni)6Sn5 intermetallics formation in the solder joint, where it grew earlier and faster relative to that in the Sn-0.7Cu-0.05Ni/Cu joint. Additionally, the addition of 1.5 wt% Bi resulted with a 3% reduction of its electrical resistance while increasing the wettability of the solder alloy. 1.5 wt% addition of the Bi element also found to have contributed to a significant increment of shear strength relative to that of the Sn-0.7Cu-0.05Ni. The results confirmed that the developed material is applicable as a potential high strength solder material in the context of advanced interconnecting applications. 2020-11-13T03:44:05Z 2020-11-13T03:44:05Z 2019-10 Article Materials & Design, vol.186, 2020, 16 pages 0264-1275 (print) 1873-4197 (online) http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68724 https://doi.org/10.1016/j.matdes.2019.108281 en Elsevier |
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Universiti Malaysia Perlis |
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http://dspace.unimap.edu.my/ |
| language |
English |
| topic |
Soldering Solder Interconnects Intermetallics Solid solution Microstructure Solder properties |
| spellingShingle |
Soldering Solder Interconnects Intermetallics Solid solution Microstructure Solder properties Mohd Izrul Izwan, Ramli Mohd Arif Anuar, Mohd Salleh H., Yasuda J., Chaiprapa K., Nogita The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering |
| description |
Link to publisher's homepage at https://www.sciencedirect.com/ |
| author2 |
mohdizrulizwan@gmail.com |
| author_facet |
mohdizrulizwan@gmail.com Mohd Izrul Izwan, Ramli Mohd Arif Anuar, Mohd Salleh H., Yasuda J., Chaiprapa K., Nogita |
| format |
Article |
| author |
Mohd Izrul Izwan, Ramli Mohd Arif Anuar, Mohd Salleh H., Yasuda J., Chaiprapa K., Nogita |
| author_sort |
Mohd Izrul Izwan, Ramli |
| title |
The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering |
| title_short |
The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering |
| title_full |
The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering |
| title_fullStr |
The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering |
| title_full_unstemmed |
The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering |
| title_sort |
effect of bi on the microstructure, electrical, wettability and mechanical properties of sn-0.7cu-0.05ni alloys for high strength soldering |
| publisher |
Elsevier |
| publishDate |
2020 |
| url |
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68724 |
| _version_ |
1698698501715656704 |
| score |
13.214268 |