Description: The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering

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Bibliographic Details
Main Authors:	‪Mohd Izrul Izwan, Ramli‬, Mohd Arif Anuar, Mohd Salleh, H., Yasuda, J., Chaiprapa, K., Nogita
Other Authors:	mohdizrulizwan@gmail.com
Format:	Article
Language:	English
Published:	Elsevier 2020
Subjects:	Soldering Solder Interconnects Intermetallics Solid solution Microstructure Solder properties
Online Access:	http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68724
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