The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering

• Main Authors: ‪Mohd Izrul Izwan, Ramli‬, Mohd Arif Anuar, Mohd Salleh, H., Yasuda, J., Chaiprapa, K., Nogita
• Other Authors: [e-mail]
• Format: Article
• Language: English
• Published: Elsevier 2020
• Subjects: Soldering; Solder; Interconnects; Intermetallics; Solid solution; Microstructure; Solder properties
• Online Access: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68724

Link to publisher's homepage at https://www.sciencedirect.com/