表紙画像

The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering

Link to publisher's homepage at https://www.sciencedirect.com/

保存先:

書誌詳細
主要な著者:	‪Mohd Izrul Izwan, Ramli‬, Mohd Arif Anuar, Mohd Salleh, H., Yasuda, J., Chaiprapa, K., Nogita
その他の著者:	mohdizrulizwan@gmail.com
フォーマット:	論文
言語:	English
出版事項:	Elsevier 2020
主題:	Soldering Solder Interconnects Intermetallics Solid solution Microstructure Solder properties
オンライン･アクセス:	http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68724
タグ:	タグ追加タグなし, このレコードへの初めてのタグを付けませんか!

類似資料

Effect of isothermal aging to the intermetallic compound (IMC) growth of Sn-0.7Cu-1.0Si₃N₄ composite solder on copper substrate
著者:: Najib Saedi, Ibrahim
出版事項: (2016)

Effect of Zinc additions on Sn-0.7Cu-0.05Ni lead free solder alloy
著者:: Nurul Ashikin, Saleh
出版事項: (2022)

Development of Lead-Free Sn-0.7Cu-Si3N4 composite solders
著者:: Muhammad Hafiz, Zan @ Hazizi
出版事項: (2016)

A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods
著者:: Mohd Arif Anuar, Mohd Salleh, 等
出版事項: (2014)

Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad
著者:: Mayappan, Ramani, 等
出版事項: (2010)

Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route
著者:: Norhayanti, Mohd Nasir
出版事項: (2017)

Effect of current stressing on intermetallic formation and mechanical properties of lead free SAC solder and SAC/activated carbon composite solder joint
著者:: Syahirah Alyaa, Yahya
出版事項: (2017)

Performance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing
著者:: Mohd Arif Anuar, Mohd Salleh, 等
出版事項: (2022)

The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement
著者:: Mohd Izrul Izwan, Ramli
出版事項: (2016)

Fabrication and characterization of hybrid microwave assisted sintering Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder
著者:: Flora, Somidin
出版事項: (2019)

Hot air solder levelling (HASL) process parameters optimization for SN100CL
著者:: Fatin Afeeqa, Mohd Sobri
出版事項: (2016)

Development od SiC reinforced SnCu and SAC based lead-free solder composite via powder metallurgy route
著者:: Zawawi, Mahim
出版事項: (2018)

Aging effect of Sn-Ag-Cu lead free solder
著者:: Mohd Jeffry, Radzi
出版事項: (2009)

Synthesis and characterization of lead free SnCu & SnCu/SiC composite solder
著者:: Nur Syahirah, Mohamad Zaini
出版事項: (2022)

Interfacial analysis of carbon nanotubes-reinforced and graphene-reinforced Sn-1.0Ag-0.5Cu solder on electroless nickel/ immersion silver surface finish
著者:: Krishna, Vidyatharran
出版事項: (2020)

Research development of solder materials and its intermetallic compound (IMC) study
著者:: Mohd Arif Anuar, Mohd Salleh, 等
出版事項: (2014)

Research development of solder materials and its intermetallic compound (IMC) study
著者:: Mohd Arif Anuar, Mohd Salleh, 等
出版事項: (2014)

Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
著者:: Mohd Izrul Izwan, Ramli, 等
出版事項: (2020)

Wettability and shear strength of Sn-Cu-Ni-xSi3N4 composite solder
著者:: Mohd Izrul, Izwan Ramli, 等
出版事項: (2019)

Study the effect of isothermal aging on Sn-Ag-Cu (SAC) lead-free solder added with silicon carbide (SiC)
著者:: Nisrin, Adli
出版事項: (2017)

Microstructure and mechanical propeties of new leadfree SAC and activated carbon composite solder
著者:: Ahmad Akhyar, Zulkarnain
出版事項: (2017)

The Sn-3.5Ag-1.0Cu-0.1Zn/Cu intermetallic interface under thermal aging / Iziana Yahya, Hamidi Abd Hamid and Ramani Mayappan
著者:: Yahya, Iziana, 等
出版事項: (2012)

Intermetallic Compound (IMC) Analysis by Using Isothermal Aging Testing on Lead Free Solder
著者:: L.Chee Ping, Azrina A., 等
出版事項: (2013)

To obtain the optimum parameters for welding of copper and aluminum using friction welding technique / Mcdawson Dewk
著者:: Dewk, Mcdawson
出版事項: (2010)

Isothermal aging affect to the growth of Sn-Cu-Ni-1 wt. % TiO2 composite solder paste
著者:: Rita, Mohd Said, 等
出版事項: (2019)

Effect of corrosion in acidic solution to the phase and microstructure of SN-CU solder
著者:: Gan, Zhi Wan
出版事項: (2017)

Study of welding on aluminum alloy 5083 / Mohd Noor Ariff Muhammad and Mohamad Nor Azuan Mohamad
著者:: Muhammad, Mohd Noor Ariff, 等
出版事項: (2002)

Influence of kaolin geopolymer ceramic additions to the wettability and electrical properties of Sn-3.0Ag-0.5Cu (SAC305) lead free solder
著者:: Mohd Arif Anuar, Mohd Salleh, 等
出版事項: (2022)

Zn-Sn based high temperature solder - A short review
著者:: Sayyidah Amnah, Musa, 等
出版事項: (2014)

Computerisation of trouble shooting in welding / Ahmad Asfanizam Mohamad and Mohd. Taufik Yusof
著者:: Mohamad, Ahmad Asfanizam, 等
出版事項: (1998)

Nickel (Ni) microalloying additions in Sn-Cu lead-free solder. short review
著者:: Mohd Arif Anuar, Mohd Salleh, 等
出版事項: (2022)

Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique
著者:: Sayyidah Amnah, Musa
出版事項: (2015)

Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review
著者:: Mohd Arif Anuar, Mohd Salleh, 等
出版事項: (2014)

Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder
著者:: Flora Somidin, 等
出版事項: (2014)

The effect of corrosion in acidic solution to the phase and microstructure of SAC305 solder
著者:: Khoo, Cheng Hao
出版事項: (2017)

Research advances of composite solder material fabricated via powder metallurgy route
著者:: Mohd Arif Anuar, Mohd Salleh, 等
出版事項: (2014)

Thermal properties of Sn-0.7Cu/re-Al composite lead-free solder
著者:: Mohd Arif Anuar, Mohd Salleh, 等
出版事項: (2014)

Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder
著者:: Mohd Arif Anuar, Mohd Salleh, 等
出版事項: (2013)

Wettability, electrical and mechanical properties of 99.3Sn-0.7Cu/Si 3N4 novel lead-free nanocomposite solder
著者:: Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr., 等
出版事項: (2011)

An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite
著者:: Norainiza, Saud, 等
出版事項: (2020)