表紙画像

Influence of shear strength on long term biased humidity reliability of Cu ball bonds

Link to publisher's homepage at http://www.springer.com/

保存先:

書誌詳細
主要な著者:	Chong, Leong Gan, Uda, Hashim, Prof. Dr.
その他の著者:	clgan_pgg@yahoo.com
フォーマット:	論文
言語:	English
出版事項:	Springer Science+Business Media New York 2015
主題:	Bond lifetime Failure rate Reliability data Secondary electron microscopy
オンライン･アクセス:	http://dspace.unimap.edu.my:80/xmlui/handle/123456789/39431
タグ:	タグ追加タグなし, このレコードへの初めてのタグを付けませんか!

類似資料

Extended reliability of gold and copper ball bonds in microelectronic packaging
著者:: Chong, Leong Gan, 等
出版事項: (2014)

Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package
著者:: Chong, Leong Gan, 等
出版事項: (2014)

Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array
著者:: Chong, Leong Gan, 等
出版事項: (2014)

Strength prediction and reliability of brittle epoxy adhesively bonded dissimilar joint
著者:: Mohd Afendi, Rojan, Dr., 等
出版事項: (2014)

A study on factors that effect bond price volatility in Malaysia bond market / Nur Hafsah Dan
著者:: Dan, Nur Hafsah
出版事項: (2011)

Reliability analysis based on weibull distribution and failure mode effect and criticality anaysis
著者:: Suhaireza, Md Esa
出版事項: (2016)

Characterization of intermetallic growth of gold ball bonds on aluminum bond pads
著者:: Mohd Khairuddin, Md Arshad, 等
出版事項: (2009)

Development of insulated Cu wire ball bonding
著者:: Leong H.Y., 等
出版事項: (2023)

Wire bond shear test simulation on hemispherical surface bond pad
著者:: Zaliman, Sauli, Dr., 等
出版事項: (2014)

Development of reliability-centered maintenance model using linguistic failure mode and effect analysis
著者:: Mohammed Ahmed Qaid, Alrifaey Moath
出版事項: (2019)

$Strength and fracture characteristics of shear adhesive dissimilar joint$

Strength and fracture characteristics of shear adhesive dissimilar joint
著者:: Mohd Afendi, 等
出版事項: (2012)

Moody's affirms Malaysian government bond rating at 'A3'
著者:: Anon
出版事項: (2016)

The factor that affect the performance of sukuk in Malaysia / Syafafah Mohd Fakiri
著者:: Mohd Fakiri, Syafafah
出版事項: (2022)

Wire bond shear test simulation
著者:: Vairavan, Rajendaran, 等
出版事項: (2013)

Surface roughness and adhesion analysis study on ultrasonic gold ball onto aluminium bond pad
著者:: Vithyacharan, Retnasamy
出版事項: (2014)

Geographical Information Technology approach and model for visualizing the lifetime value of customersin the geographical marketplace
著者:: Abdul Manaf, Bohari, 等
出版事項: (2015)

Reliability and availability assessment of transmission overhead line protection system using reliability block diagram
著者:: Ridwan M.I., 等
出版事項: (2023)

Modes of failure and microscopic failures of Betong bamboo strips loaded in shear, bending, tension and compression / Shahril Anuar Bahari
著者:: Bahari, Shahril Anuar
出版事項: (2005)

Techniques in Integrated Circuit (IC) failure analysis
著者:: Zul Azhar, Zahid Jamal, Assoc. Prof. Dr., 等
出版事項: (2009)

An Analysis of Distribution Automation Reliability Using Monte Carlo Simulation
著者:: Norsabrina Binti Madzlan
出版事項: (2023)

Maintenance and reliability engineering
著者:: Ooi, Suvarna
出版事項: (2011)

Determinant of bond market in Malaysia / Shamsul Arif Zulfikar Husni
著者:: Zulfikar Husni, Shamsul Arif
出版事項: (2022)

The determinants that affect government bond yield in Malaysia / Natasha Zulkifli
著者:: Zulkifli, Natasha
出版事項: (2022)

Economic impact of sovereign debt credit rating revision
著者:: Pour, Reza Tahmoores
出版事項: (2017)

Wire bond shear test simulation on sharp groove surface bond pad
著者:: Zaliman, Sauli, Dr., 等
出版事項: (2014)

Reliability & Failure Analysis
著者:: Kolej Universiti Kejuruteraan Utara Malaysia
出版事項: (2008)

Reliability & Failure Analysis
著者:: Kolej Universiti Kejuruteraan Utara Malaysia
出版事項: (2008)

Corporate bond as a source of finance for technology companies in emerging economies / Wishal Iman Amalia Razali
著者:: Razali, Wishal Iman Amalia
出版事項: (2022)

Thermal aging study at 150 °C and 200 °C: Gold ball bonds to aluminum bond pad
著者:: Mohd Khairuddin, Md Arshad, 等
出版事項: (2010)

Characterization of Intermetallic Growth in Gold Ballbonds on Aluminum Metallization
著者:: Lim Moy Fung
出版事項: (2008)

Assessment on the ASEAN standards to support sustainable and responsible investments (SRIs) and green bonds / Muhammad Zarunnaim Wahab and Asmadi Mohamed Naim
著者:: Wahab, Muhammad Zarunnaim, 等
出版事項: (2021)

Reliability and Failure Analysis
著者:: Universiti Malaysia Perlis (UniMAP)
出版事項: (2019)

Reliability and Failure Analysis
著者:: Universiti Malaysia Perlis (UniMAP)
出版事項: (2015)

Reliability and Failure Analysis
著者:: Universiti Malaysia Perlis (UniMAP)
出版事項: (2015)

Reliability and Failure Analysis
著者:: Universiti Malaysia Perlis (UniMAP)
出版事項: (2014)

Reliability and Failure Analysis
著者:: Universiti Malaysia Perlis (UniMAP)
出版事項: (2018)

Reliability and Failure Analysis
著者:: Universiti Malaysia Perlis (UniMAP)
出版事項: (2018)

Reliability and Failure Analysis
著者:: Universiti Malaysia Perlis
出版事項: (2010)

Reliability and Failure Analysis
著者:: Universiti Malaysia Perlis
出版事項: (2009)

Reliability and Failure Analysis
著者:: Universiti Malaysia Perlis
出版事項: (2009)