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Influence of shear strength on long term biased humidity reliability of Cu ball bonds

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Main Authors: Chong, Leong Gan, Uda, Hashim, Prof. Dr.
Other Authors: clgan_pgg@yahoo.com
Format: Article
Language:English
Published: Springer Science+Business Media New York 2015
Subjects:
Bond lifetime
Failure rate
Reliability data
Secondary electron microscopy
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/39431
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spelling my.unimap-394312015-04-13T03:48:05Z Influence of shear strength on long term biased humidity reliability of Cu ball bonds Chong, Leong Gan Uda, Hashim, Prof. Dr. clgan_pgg@yahoo.com uda@unimap.edu.my Bond lifetime Failure rate Reliability data Secondary electron microscopy Link to publisher's homepage at http://www.springer.com/ This paper compares and discusses the influence of shear strength (in terms of shear-per mils-square) of Au and Cu ball bonds on the biased humidity reliability performance in SOIC 8LD leaded package. Biased (HAST) highly accelerated temperature and humidity stress test, 130 °C, 85 % RH) has been carried out to estimate the long term reliability of Au and Cu ball bonds. Lognormal reliability plots have been plotted for the three legs (control, leg 1 and leg 2) whereby Shear-per-mil-square of 6.68 is identified to have better mean-time-to-failure (t50) compared to other two legs. Open failure from biased HAST 96, 192 h are subjected for secondary electron microscopy cross-sectioning and found typical interfacial CuAl intermetallic compound corrosion microcracking. HAST failure rates have been analyzed and the Cu ball bond lifetime has been established by using Peck model. The obtained Cu ball bond lifetime, of SPMS of 6.68 is >25 years and belongs to wearout reliability data point. This proves significant influence of SPMS on biased HAST failure rate. The higher the ball bond shear strength the lower the failure rate of biased HAST test. Hence, we should implement control on the average SPMS of ≥7.50 g/mil2. 2015-04-13T03:48:05Z 2015-04-13T03:48:05Z 2014-10 Article Journal of Materials Science: Materials in Electronics, vol. 25(11), 2014, pages 4786-4792 0957-4522 http://link.springer.com/article/10.1007%2Fs10854-014-2234-2 http://dspace.unimap.edu.my:80/xmlui/handle/123456789/39431 en Springer Science+Business Media New York
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Bond lifetime
Failure rate
Reliability data
Secondary electron microscopy
spellingShingle Bond lifetime
Failure rate
Reliability data
Secondary electron microscopy
Chong, Leong Gan
Uda, Hashim, Prof. Dr.
Influence of shear strength on long term biased humidity reliability of Cu ball bonds
description Link to publisher's homepage at http://www.springer.com/
author2 clgan_pgg@yahoo.com
author_facet clgan_pgg@yahoo.com
Chong, Leong Gan
Uda, Hashim, Prof. Dr.
format Article
author Chong, Leong Gan
Uda, Hashim, Prof. Dr.
author_sort Chong, Leong Gan
title Influence of shear strength on long term biased humidity reliability of Cu ball bonds
title_short Influence of shear strength on long term biased humidity reliability of Cu ball bonds
title_full Influence of shear strength on long term biased humidity reliability of Cu ball bonds
title_fullStr Influence of shear strength on long term biased humidity reliability of Cu ball bonds
title_full_unstemmed Influence of shear strength on long term biased humidity reliability of Cu ball bonds
title_sort influence of shear strength on long term biased humidity reliability of cu ball bonds
publisher Springer Science+Business Media New York
publishDate 2015
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/39431
_version_ 1643799064863571968
score 13.226497

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