Flip chip thermal test vehicle design: Requirements, evaluations, and validations
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Main Authors: | Goh, Teck Joo, Chu, Chia Pin, Seetharamu, Kankanhally N., Ghulam, Abdul Quadir, Prof. Dr., Zainal Alimuddin, Zainal Alauddin, Dr. |
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Other Authors: | knseetharamu@hotmail.com |
Format: | Working Paper |
Language: | English |
Published: |
ASME
2014
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Subjects: | |
Online Access: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/33881 |
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