Flip chip thermal test vehicle design: Requirements, evaluations, and validations

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Bibliographic Details
Main Authors: Goh, Teck Joo, Chu, Chia Pin, Seetharamu, Kankanhally N., Ghulam, Abdul Quadir, Prof. Dr., Zainal Alimuddin, Zainal Alauddin, Dr.
Other Authors: knseetharamu@hotmail.com
Format: Working Paper
Language:English
Published: ASME 2014
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Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33881
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