Flip chip thermal test vehicle design: Requirements, evaluations, and validations
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my.unimap-338812014-04-21T06:41:53Z Flip chip thermal test vehicle design: Requirements, evaluations, and validations Goh, Teck Joo Chu, Chia Pin Seetharamu, Kankanhally N. Ghulam, Abdul Quadir, Prof. Dr. Zainal Alimuddin, Zainal Alauddin, Dr. knseetharamu@hotmail.com gaquadir@unimap.edu.my And finite-element analysis Flip chip thermal test vehicle Thermal characterization Link to publisher's homepage at http://asmedigitalcollection.asme.org/ This paper reviews the design of a flip chip thermal test vehicle. Design requirements for different applications such as thermal characterization, assembly process optimization, and product burn-in simulation are outlined. The design processes of different thermal test chip structures including the temperature sensor and passive heaters are described in detail. In addition, the design of fireball heater, a novel test chip structure used for evaluating the effectiveness of heat spreading of advanced thermal solutions, is also illustrated. The design considerations and processes of the package substrate and printed circuit board with special emphasis on the physical routing of the thermal test chip structures are described. These design processes are supported with thermal data from various finite-element analyses (FEA) carried out to evaluate the capability and limitations of thermal test vehicle design. Design optimization as the outcome of these analyses is also elaborated. Lastly, the validation and calibration procedures of the thermal test vehicle are presented in this paper. 2014-04-21T06:41:53Z 2014-04-21T06:41:53Z 2003 Working Paper Advances in Electronic Packaging, vol. 2, 2003, pages 323-330 0-7918-3690-8 0-7918-3674-6 (elSBN) http://dspace.unimap.edu.my:80/dspace/handle/123456789/33881 http://proceedings.asmedigitalcollection.asme.org/proceeding.aspx?articleid=1579467 10.1115/IPACK2003-35142 en ASME |
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And finite-element analysis Flip chip thermal test vehicle Thermal characterization |
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And finite-element analysis Flip chip thermal test vehicle Thermal characterization Goh, Teck Joo Chu, Chia Pin Seetharamu, Kankanhally N. Ghulam, Abdul Quadir, Prof. Dr. Zainal Alimuddin, Zainal Alauddin, Dr. Flip chip thermal test vehicle design: Requirements, evaluations, and validations |
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Link to publisher's homepage at http://asmedigitalcollection.asme.org/ |
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knseetharamu@hotmail.com |
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knseetharamu@hotmail.com Goh, Teck Joo Chu, Chia Pin Seetharamu, Kankanhally N. Ghulam, Abdul Quadir, Prof. Dr. Zainal Alimuddin, Zainal Alauddin, Dr. |
format |
Working Paper |
author |
Goh, Teck Joo Chu, Chia Pin Seetharamu, Kankanhally N. Ghulam, Abdul Quadir, Prof. Dr. Zainal Alimuddin, Zainal Alauddin, Dr. |
author_sort |
Goh, Teck Joo |
title |
Flip chip thermal test vehicle design: Requirements, evaluations, and validations |
title_short |
Flip chip thermal test vehicle design: Requirements, evaluations, and validations |
title_full |
Flip chip thermal test vehicle design: Requirements, evaluations, and validations |
title_fullStr |
Flip chip thermal test vehicle design: Requirements, evaluations, and validations |
title_full_unstemmed |
Flip chip thermal test vehicle design: Requirements, evaluations, and validations |
title_sort |
flip chip thermal test vehicle design: requirements, evaluations, and validations |
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ASME |
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2014 |
url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/33881 |
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1643797324757991424 |
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13.18916 |