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Flip chip thermal test vehicle design: Requirements, evaluations, and validations

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Main Authors: Goh, Teck Joo, Chu, Chia Pin, Seetharamu, Kankanhally N., Ghulam, Abdul Quadir, Prof. Dr., Zainal Alimuddin, Zainal Alauddin, Dr.
Other Authors: knseetharamu@hotmail.com
Format: Working Paper
Language:English
Published: ASME 2014
Subjects:
And finite-element analysis
Flip chip thermal test vehicle
Thermal characterization
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33881
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spelling my.unimap-338812014-04-21T06:41:53Z Flip chip thermal test vehicle design: Requirements, evaluations, and validations Goh, Teck Joo Chu, Chia Pin Seetharamu, Kankanhally N. Ghulam, Abdul Quadir, Prof. Dr. Zainal Alimuddin, Zainal Alauddin, Dr. knseetharamu@hotmail.com gaquadir@unimap.edu.my And finite-element analysis Flip chip thermal test vehicle Thermal characterization Link to publisher's homepage at http://asmedigitalcollection.asme.org/ This paper reviews the design of a flip chip thermal test vehicle. Design requirements for different applications such as thermal characterization, assembly process optimization, and product burn-in simulation are outlined. The design processes of different thermal test chip structures including the temperature sensor and passive heaters are described in detail. In addition, the design of fireball heater, a novel test chip structure used for evaluating the effectiveness of heat spreading of advanced thermal solutions, is also illustrated. The design considerations and processes of the package substrate and printed circuit board with special emphasis on the physical routing of the thermal test chip structures are described. These design processes are supported with thermal data from various finite-element analyses (FEA) carried out to evaluate the capability and limitations of thermal test vehicle design. Design optimization as the outcome of these analyses is also elaborated. Lastly, the validation and calibration procedures of the thermal test vehicle are presented in this paper. 2014-04-21T06:41:53Z 2014-04-21T06:41:53Z 2003 Working Paper Advances in Electronic Packaging, vol. 2, 2003, pages 323-330 0-7918-3690-8 0-7918-3674-6 (elSBN) http://dspace.unimap.edu.my:80/dspace/handle/123456789/33881 http://proceedings.asmedigitalcollection.asme.org/proceeding.aspx?articleid=1579467 10.1115/IPACK2003-35142 en ASME
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic And finite-element analysis
Flip chip thermal test vehicle
Thermal characterization
spellingShingle And finite-element analysis
Flip chip thermal test vehicle
Thermal characterization
Goh, Teck Joo
Chu, Chia Pin
Seetharamu, Kankanhally N.
Ghulam, Abdul Quadir, Prof. Dr.
Zainal Alimuddin, Zainal Alauddin, Dr.
Flip chip thermal test vehicle design: Requirements, evaluations, and validations
description Link to publisher's homepage at http://asmedigitalcollection.asme.org/
author2 knseetharamu@hotmail.com
author_facet knseetharamu@hotmail.com
Goh, Teck Joo
Chu, Chia Pin
Seetharamu, Kankanhally N.
Ghulam, Abdul Quadir, Prof. Dr.
Zainal Alimuddin, Zainal Alauddin, Dr.
format Working Paper
author Goh, Teck Joo
Chu, Chia Pin
Seetharamu, Kankanhally N.
Ghulam, Abdul Quadir, Prof. Dr.
Zainal Alimuddin, Zainal Alauddin, Dr.
author_sort Goh, Teck Joo
title Flip chip thermal test vehicle design: Requirements, evaluations, and validations
title_short Flip chip thermal test vehicle design: Requirements, evaluations, and validations
title_full Flip chip thermal test vehicle design: Requirements, evaluations, and validations
title_fullStr Flip chip thermal test vehicle design: Requirements, evaluations, and validations
title_full_unstemmed Flip chip thermal test vehicle design: Requirements, evaluations, and validations
title_sort flip chip thermal test vehicle design: requirements, evaluations, and validations
publisher ASME
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/33881
_version_ 1643797324757991424
score 13.18916

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