Flip chip thermal test vehicle design: Requirements, evaluations, and validations

• Main Authors: Goh, Teck Joo, Chu, Chia Pin, Seetharamu, Kankanhally N., Ghulam, Abdul Quadir, Prof. Dr., Zainal Alimuddin, Zainal Alauddin, Dr.
• Other Authors: [e-mail]
• Format: Working Paper
• Language: English
• Published: ASME 2014
• Subjects: And finite-element analysis; Flip chip thermal test vehicle; Thermal characterization
• Online Access: http://dspace.unimap.edu.my:80/dspace/handle/123456789/33881

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