Interaction relationship analysis of surface roughness on aluminium etched wafer using RIE
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Main Authors: | Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Aaron, Koay Terr Yeow, Wei Wei, Ng |
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Other Authors: | vc.sundres@gmail.com |
Format: | Article |
Language: | English |
Published: |
Trans Tech Publications
2014
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Subjects: | |
Online Access: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/33660 |
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