Description: Interaction relationship analysis of surface roughness on aluminium etched wafer using RIE

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Bibliographic Details
Main Authors:	Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Aaron, Koay Terr Yeow, Wei Wei, Ng
Other Authors:	vc.sundres@gmail.com
Format:	Article
Language:	English
Published:	Trans Tech Publications 2014
Subjects:	Aluminum Design of experiment (DOE) Reactive Ion Etching (RIE) Surface roughness
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/33660
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Summary:	Link to publisher's homepage at http://www.ttp.net/