Investigation of surface roughness on platinum deposited wafer after reactive ion etching using SF₆+Argon gaseous
Link to publisher's homepage at http://www.ttp.net/
Saved in:
Main Authors: | Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Aaron, Koay Terr Yeow, Siew Chui, Goh, Khairul Anwar, Mohamad Khazali, Nooraihan, Abdullah |
---|---|
Other Authors: | zaliman@unimap.edu.my |
Format: | Article |
Language: | English |
Published: |
Trans Tech Publications
2014
|
Subjects: | |
Online Access: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/33656 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Surface roughness scrutinizaton with RIE CF₄+Argon gaseous on platinum deposited wafer
by: Zaliman, Sauli, Dr., et al.
Published: (2014) -
Surface roughness and wettability correlation on etched platinum using reactive ion ecthing
by: Zaliman, Sauli, Dr., et al.
Published: (2014) -
Surface roughness analysis on reactive ion etched aluminium deposited wafer
by: Zaliman, Sauli, Dr., et al.
Published: (2014) -
Wettability analysis on platinum deposited wafer after reactive ion ecthing using SF6+argon/CF4+argon gaseous
by: Retnasamy, Vithyacharan, et al.
Published: (2014) -
Interaction relationship analysis of surface roughness on aluminium etched wafer using RIE
by: Zaliman, Sauli, Dr., et al.
Published: (2014)