Reliability assessment and activation energy study of au and pd-coated cu wires post high temperature aging in nanoscale semiconductor packaging

• Main Authors: Chong, Leong Gan, Uda, Hashim, Prof. Dr.
• Other Authors: [e-mail]
• Format: Article
• Language: English
• Published: American Society of Mechanical Engineers (ASME) 2014
• Subjects: Apparent activation energy; Arrhenius plot; High temperature storage life; Lognormal plot; Semiconductor device; Wearout reliability
• Online Access: http://dspace.unimap.edu.my:80/dspace/handle/123456789/33098

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