Description: Reliability assessment and activation energy study of au and pd-coated cu wires post high temperature aging in nanoscale semiconductor packaging

Link to publisher's homepage at https://www.asme.org/

Saved in:

Bibliographic Details
Main Authors:	Chong, Leong Gan, Uda, Hashim, Prof. Dr.
Other Authors:	chong-leong.gan@spansion.com
Format:	Article
Language:	English
Published:	American Society of Mechanical Engineers (ASME) 2014
Subjects:	Apparent activation energy Arrhenius plot High temperature storage life Lognormal plot Semiconductor device Wearout reliability
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/33098
Tags:	Add Tag No Tags, Be the first to tag this record!

Description
Summary:	Link to publisher's homepage at https://www.asme.org/