Holdings: Reliability assessment and activation energy study of au and pd-coated cu wires post high temperature aging in nanoscale semiconductor packaging

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Bibliographic Details
Main Authors:	Chong, Leong Gan, Uda, Hashim, Prof. Dr.
Other Authors:	chong-leong.gan@spansion.com
Format:	Article
Language:	English
Published:	American Society of Mechanical Engineers (ASME) 2014
Subjects:	Apparent activation energy Arrhenius plot High temperature storage life Lognormal plot Semiconductor device Wearout reliability
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/33098
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