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Reliability assessment and activation energy study of au and pd-coated cu wires post high temperature aging in nanoscale semiconductor packaging

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Main Authors: Chong, Leong Gan, Uda, Hashim, Prof. Dr.
Other Authors: chong-leong.gan@spansion.com
Format: Article
Language:English
Published: American Society of Mechanical Engineers (ASME) 2014
Subjects:
Apparent activation energy
Arrhenius plot
High temperature storage life
Lognormal plot
Semiconductor device
Wearout reliability
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33098
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spelling my.unimap-330982014-03-25T04:42:41Z Reliability assessment and activation energy study of au and pd-coated cu wires post high temperature aging in nanoscale semiconductor packaging Chong, Leong Gan Uda, Hashim, Prof. Dr. chong-leong.gan@spansion.com clgan_pgg@yahoo.com uda@unimap.edu.my Apparent activation energy Arrhenius plot High temperature storage life Lognormal plot Semiconductor device Wearout reliability Link to publisher's homepage at https://www.asme.org/ Wearout reliability and high temperature storage life (HTSL) activation energy of Au and Pd-coated Cu (PdCu) ball bonds are useful technical information for Cu wire deployment in nanoscale semiconductor device packaging. This paper discusses the influence of wire type on the wearout reliability performance of Au and PdCu wire used in fine pitch BGA package after HTSL stress at various aging temperatures. Failure analysis has been conducted to identify the failure mechanism after HTSL wearout conditions for Au and PdCu ball bonds. Apparent activation energies (Eaa) of both wire types are investigated after HTSL test at 150 °C, 175 °C and 200 °C aging temperatures. Arrhenius plot has been plotted for each ball bond types and the calculated Eaa of PdCu ball bond is 0.85 eV and 1.10 eV for Au ball bond in 110 nm semiconductor device. Obviously Au ball bond is identified with faster IMC formation rate with IMC Kirkendall voiding while PdCu wire exhibits equivalent wearout and or better wearout reliability margin compare to conventional Au wirebond. Lognormal plots have been established and its mean to failure (t50) have been discussed in this paper. 2014-03-25T04:42:40Z 2014-03-25T04:42:40Z 2013 Article Journal of Electronic Packaging, Transactions of the ASME, vol. 135(2), 2013, pages 1-7 1043-7398 http://electronicpackaging.asmedigitalcollection.asme.org/article.aspx?articleid=1678076 http://dspace.unimap.edu.my:80/dspace/handle/123456789/33098 en American Society of Mechanical Engineers (ASME)
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Apparent activation energy
Arrhenius plot
High temperature storage life
Lognormal plot
Semiconductor device
Wearout reliability
spellingShingle Apparent activation energy
Arrhenius plot
High temperature storage life
Lognormal plot
Semiconductor device
Wearout reliability
Chong, Leong Gan
Uda, Hashim, Prof. Dr.
Reliability assessment and activation energy study of au and pd-coated cu wires post high temperature aging in nanoscale semiconductor packaging
description Link to publisher's homepage at https://www.asme.org/
author2 chong-leong.gan@spansion.com
author_facet chong-leong.gan@spansion.com
Chong, Leong Gan
Uda, Hashim, Prof. Dr.
format Article
author Chong, Leong Gan
Uda, Hashim, Prof. Dr.
author_sort Chong, Leong Gan
title Reliability assessment and activation energy study of au and pd-coated cu wires post high temperature aging in nanoscale semiconductor packaging
title_short Reliability assessment and activation energy study of au and pd-coated cu wires post high temperature aging in nanoscale semiconductor packaging
title_full Reliability assessment and activation energy study of au and pd-coated cu wires post high temperature aging in nanoscale semiconductor packaging
title_fullStr Reliability assessment and activation energy study of au and pd-coated cu wires post high temperature aging in nanoscale semiconductor packaging
title_full_unstemmed Reliability assessment and activation energy study of au and pd-coated cu wires post high temperature aging in nanoscale semiconductor packaging
title_sort reliability assessment and activation energy study of au and pd-coated cu wires post high temperature aging in nanoscale semiconductor packaging
publisher American Society of Mechanical Engineers (ASME)
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/33098
_version_ 1643797066941464576
score 13.214268

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