Reliability assessment and activation energy study of au and pd-coated cu wires post high temperature aging in nanoscale semiconductor packaging
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
American Society of Mechanical Engineers (ASME)
2014
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| Online Access: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/33098 |
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