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Reliability assessment and activation energy study of au and pd-coated cu wires post high temperature aging in nanoscale semiconductor packaging

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書誌詳細
主要な著者:	Chong, Leong Gan, Uda, Hashim, Prof. Dr.
その他の著者:	chong-leong.gan@spansion.com
フォーマット:	論文
言語:	English
出版事項:	American Society of Mechanical Engineers (ASME) 2014
主題:	Apparent activation energy Arrhenius plot High temperature storage life Lognormal plot Semiconductor device Wearout reliability
オンライン･アクセス:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/33098
タグ:	タグ追加タグなし, このレコードへの初めてのタグを付けませんか!

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