Thermal expansion behavior of the electroless copper coated Cu-SiCp composites fabricated via the conventional powder metallurgical technique
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Main Authors: | Azmi, Kamardin, Mohd Nazree, Derman, Dr., Mohd Mustafa Al-Bakri, Abdullah, Sandu, A.V. |
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Other Authors: | azmikamardin@unimap.edu.my |
Format: | Article |
Language: | English |
Published: |
Trans Tech Publications
2014
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Online Access: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/32671 |
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