Cover Image

Thermal expansion behavior of the electroless copper coated Cu-SiCp composites fabricated via the conventional powder metallurgical technique

Link to publisher's homepage at http://www.ttp.net/

Saved in:
Bibliographic Details
Main Authors: Azmi, Kamardin, Mohd Nazree, Derman, Dr., Mohd Mustafa Al-Bakri, Abdullah, Sandu, A.V.
Other Authors: azmikamardin@unimap.edu.my
Format: Article
Language:English
Published: Trans Tech Publications 2014
Subjects:
Copper matrix composites
Electroless copper
Silicon carbide particles
Thermal expansion
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/32671
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.unimap-32671
record_format dspace
spelling my.unimap-326712014-03-13T08:42:49Z Thermal expansion behavior of the electroless copper coated Cu-SiCp composites fabricated via the conventional powder metallurgical technique Azmi, Kamardin Mohd Nazree, Derman, Dr. Mohd Mustafa Al-Bakri, Abdullah Sandu, A.V. azmikamardin@unimap.edu.my Copper matrix composites Electroless copper Silicon carbide particles Thermal expansion Link to publisher's homepage at http://www.ttp.net/ The introduction of the metal matrix composites as the advanced electronic packaging materials is highly anticipated because their thermal properties can be engineered to match those of semiconductors, ceramics substrates and optical fibers. Among these advanced packaging materials, silicon carbide particles reinforced copper matrix (Cu-SiCp) composites are highly rated due to the high thermal conductivity of copper and low coefficient of thermal expansion (CTE) of silicon carbide. However, the Cu-SiCp composites fabricated via the conventional powder metallurgy (PM) technique usually have immature thermophysical properties due to the weak bonding between the copper matrix and the SiCp reinforcement. In order to improve the bonding between the two constituents, the SiCp were coated with copper via electroless coating process prior to PM fabrication processes. Based on the experimental results, The CTE and porosity of the Cu-SiCp composites were significantly affected by the volume fraction of SiCp. Furthermore, the CTE and porosity of the Cu-Coated Cu-SiCp composites were significantly lower than the non-Coated Cu-SiCp composites. These differences were mainly contributed by the nature of the bonding between the copper matrix and SiCp reinforcement. 2014-03-13T08:42:49Z 2014-03-13T08:42:49Z 2014-01 Article Key Engineering Materials, vol.594-595, 2014, pages 857-861 1662-9795 http://dspace.unimap.edu.my:80/dspace/handle/123456789/32671 http://www.scientific.net/KEM.594-595.857 en Trans Tech Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Copper matrix composites
Electroless copper
Silicon carbide particles
Thermal expansion
spellingShingle Copper matrix composites
Electroless copper
Silicon carbide particles
Thermal expansion
Azmi, Kamardin
Mohd Nazree, Derman, Dr.
Mohd Mustafa Al-Bakri, Abdullah
Sandu, A.V.
Thermal expansion behavior of the electroless copper coated Cu-SiCp composites fabricated via the conventional powder metallurgical technique
description Link to publisher's homepage at http://www.ttp.net/
author2 azmikamardin@unimap.edu.my
author_facet azmikamardin@unimap.edu.my
Azmi, Kamardin
Mohd Nazree, Derman, Dr.
Mohd Mustafa Al-Bakri, Abdullah
Sandu, A.V.
format Article
author Azmi, Kamardin
Mohd Nazree, Derman, Dr.
Mohd Mustafa Al-Bakri, Abdullah
Sandu, A.V.
author_sort Azmi, Kamardin
title Thermal expansion behavior of the electroless copper coated Cu-SiCp composites fabricated via the conventional powder metallurgical technique
title_short Thermal expansion behavior of the electroless copper coated Cu-SiCp composites fabricated via the conventional powder metallurgical technique
title_full Thermal expansion behavior of the electroless copper coated Cu-SiCp composites fabricated via the conventional powder metallurgical technique
title_fullStr Thermal expansion behavior of the electroless copper coated Cu-SiCp composites fabricated via the conventional powder metallurgical technique
title_full_unstemmed Thermal expansion behavior of the electroless copper coated Cu-SiCp composites fabricated via the conventional powder metallurgical technique
title_sort thermal expansion behavior of the electroless copper coated cu-sicp composites fabricated via the conventional powder metallurgical technique
publisher Trans Tech Publications
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/32671
_version_ 1643796958456840192
score 13.209306

Similar Items