Holdings: Cu-SiCp composites as advanced electronic packaging materials

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Bibliographic Details
Main Authors:	Azmi, Kamardin, Mohd Nazree, Derman, Dr., Mohd Mustafa Al Bakri, Abdullah, Sandu, A.V.
Other Authors:	azmikamardin@unimap.edu.my
Format:	Article
Language:	English
Published:	Trans Tech Publications 2014
Subjects:	Electroless copper Electronic packaging materials Metal matrix composite (MMC)
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/34512
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