Azmi, K., & azmikamardin@unimap.edu.my. (2014). Thermal expansion behavior of the electroless copper coated Cu-SiCp composites fabricated via the conventional powder metallurgical technique. Trans Tech Publications.
Chicago Style CitationAzmi, Kamardin, and azmikamardin@unimap.edu.my. Thermal Expansion Behavior of the Electroless Copper Coated Cu-SiCp Composites Fabricated Via the Conventional Powder Metallurgical Technique. Trans Tech Publications, 2014.
MLA CitationAzmi, Kamardin, and azmikamardin@unimap.edu.my. Thermal Expansion Behavior of the Electroless Copper Coated Cu-SiCp Composites Fabricated Via the Conventional Powder Metallurgical Technique. Trans Tech Publications, 2014.
Warning: These citations may not always be 100% accurate.