Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application
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| Format: | Learning Object |
| Language: | English |
| Published: |
Universiti Malaysia Perlis
2012
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| Online Access: | http://dspace.unimap.edu.my/xmlui/handle/123456789/19839 |
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