Holdings: Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application

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Bibliographic Details
Main Author:	Siti Amira Faisha Shikh Zakaria
Other Authors:	Prof. Madya. Ir. Mohabattul Zaman Sns Bukhari
Format:	Learning Object
Language:	English
Published:	Universiti Malaysia Perlis 2012
Subjects:	SiC powder Materials engineering Cooper silicon carbide Silicon carbide Powder metallurgy
Online Access:	http://dspace.unimap.edu.my/xmlui/handle/123456789/19839
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