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Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application

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Bibliographic Details
Main Author: Siti Amira Faisha Shikh Zakaria
Other Authors: Prof. Madya. Ir. Mohabattul Zaman Sns Bukhari
Format: Learning Object
Language:English
Published: Universiti Malaysia Perlis 2012
Subjects:
SiC powder
Materials engineering
Cooper silicon carbide
Silicon carbide
Powder metallurgy
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/19839
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spelling my.unimap-198392012-06-13T03:56:06Z Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application Siti Amira Faisha Shikh Zakaria Prof. Madya. Ir. Mohabattul Zaman Sns Bukhari SiC powder Materials engineering Cooper silicon carbide Silicon carbide Powder metallurgy Access is limited to UniMAP community. The use of SiC particles as reinforcements in copper based composites is considered very attractive to meet the increasing demands for high performance heat sink materials and packages since copper is a better thermal conductivity material (Cu: 400W/mK).The physical, mechanical and thermal properties of different particle sizes and volume fraction of silicon carbide reinforce in copper metal matrix composite were investigated. Powder metallurgy (P/M) method was used to fabricate the composite. Cu powder and SiC powder were mixed together in a planetary ball mill at 200rpm for two hours. Compaction with 12 tonne, and the green compact is sintered at 950oC with 6 hours soaking time in nitrogen atmosphere. The test analysis was consists of microstructure, hardness, density, porosity, and relative thermal conductivity of the copper silicon carbide composite. Sample with 5% and 10 % SiC experienced shrinkage while the 20% SiC sample shows swelling. Densities and relative thermal conductivity markedly decrease by increasing % volume and doest not shows large significant difference of mesh size. Porosity increased with % volume increased and does not show significant different between mesh size. While Hardness increase significantly with volume but decrease for the sample with 20 % SiC caused by porosity. Decreasing of size particle shows increase of hardness for sample with 5 % and 10% SiC. 2012-06-13T03:56:06Z 2012-06-13T03:56:06Z 2008-04 Learning Object http://hdl.handle.net/123456789/19839 en Universiti Malaysia Perlis School of Materials Engineering
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic SiC powder
Materials engineering
Cooper silicon carbide
Silicon carbide
Powder metallurgy
spellingShingle SiC powder
Materials engineering
Cooper silicon carbide
Silicon carbide
Powder metallurgy
Siti Amira Faisha Shikh Zakaria
Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application
description Access is limited to UniMAP community.
author2 Prof. Madya. Ir. Mohabattul Zaman Sns Bukhari
author_facet Prof. Madya. Ir. Mohabattul Zaman Sns Bukhari
Siti Amira Faisha Shikh Zakaria
format Learning Object
author Siti Amira Faisha Shikh Zakaria
author_sort Siti Amira Faisha Shikh Zakaria
title Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application
title_short Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application
title_full Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application
title_fullStr Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application
title_full_unstemmed Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application
title_sort effects of volume fraction and particle size reinforcement parameter on microstructural and thermal properties of copper silicon carbide (cusic) composite for electronic packaging application
publisher Universiti Malaysia Perlis
publishDate 2012
url http://dspace.unimap.edu.my/xmlui/handle/123456789/19839
_version_ 1643787867972960256
score 13.222552

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