Electrochemical corrosion behavior of Sn-0.7Cu solder alloy with the addition of bismuth and iron
The corrosion behavior of Fe and Bi added Sn-0.7Cu solder was investigated in 3.5 wt% NaCl solution. Addition of Fe and Bi results in higher corrosion current density, reduction in passivation and pseudo passivation domain. Formation of FeSn2 continuously forces the Sn to dissolve, forming SnCl2 and...
Saved in:
Main Authors: | Jaffery, Hasan Abbas, Sabri, Mohd Faizul Mohd, Said, Suhana Mohd, Hasan, Syed Waqar, Sajid, Imran Haider, Nordin, Nor Ilyana Muhd, Megat Hasnan, Megat Muhammad Ikhsan, Shnawah, Dhafer Abdulameer, Moorthy, Chellapilla V.K.N.S.N. |
---|---|
Format: | Article |
Published: |
Elsevier
2019
|
Subjects: | |
Online Access: | http://eprints.um.edu.my/24113/ https://doi.org/10.1016/j.jallcom.2019.151925 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi
by: Jaffery, Syed Hassan Abbas, et al.
Published: (2022) -
Study on coarsening of Ag3Sn intermetallic compound in the Fe-modified Sn-1Ag-0.5Cu solder alloys
by: Shnawah, D.A., et al.
Published: (2015) -
Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder
by: Goh, Y., et al.
Published: (2013) -
Evaluation of electrical properties, oxidation and corrosion behavior of Fe and Bi added Sn-0.7 Cu lead-free solder alloy / Syed Hassan Abbas Jaffery
by: Syed Hassan , Abbas Jaffery
Published: (2017) -
Enhancement of Thermoelectric Properties in Cold Pressed Nickel Doped Bismuth Sulfide Compounds
by: Fitriani, Fitriani, et al.
Published: (2018)