A review on mechanical properties of SnAgCu/Cu joint using laser soldering

• Main Authors: Nabila, Tamar Jaya, Siti Rabiatull Aisha, Idris, M., Ishak
• Format: Book Section
• Language: English; English
• Published: Springer, Singapore 2018
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://umpir.ump.edu.my/id/eprint/24641/1/2.%20A%20review%20on%20mechanical%20properties%20of%20SnAgCuCu%20joint%20using%20laser%20soldering.pdf; http://umpir.ump.edu.my/id/eprint/24641/2/2.1%20A%20review%20on%20mechanical%20properties%20of%20SnAgCuCu%20joint%20using%20laser%20soldering.pdf; http://umpir.ump.edu.my/id/eprint/24641/; https://doi.org/10.1007/978-981-10-9041-7_8; https://doi.org/10.1007/978-981-10-9041-7_8

This paper focuses on publishing the review of mechanical properties at the interface between SnAgCu (SAC) solder and Copper substrate after laser soldering. This involved on basic principles of solder alloy and Copper diffusion mechanism. In addition, this paper also reviews laser solder effects to...