Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints
This work utilizes the lap shear test to investigate the shear strength and fracture behaviour of electroplated and reflowed Sn–Bi/Cu lead-free solder joints. Particular emphasis is given on the effects of reflow temperature on the interrelationships among the interfacial intermetallic compound (IMC...
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| Main Authors: | , , , |
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| Format: | Article |
| Published: |
Kluwer (now part of Springer)
2015
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/17449/ http://dx.doi.org/10.1007/s10853-015-8978-0 |
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