Effect of Sn plating thickness on wettability, solderability, and electrical connections of electronic lead connectors for surface mount technology applications
The wettability of solder is important to achieve good solderability between the electronic component and printed circuit board (PCB). Tin (Sn) plating is widely used to promote the wettability of the solder on the substrates. However, an adequate amount of Sn plating thickness must be taken into co...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Penerbit Universiti Kebangsaan Malaysia
2023
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| Online Access: | http://journalarticle.ukm.my/23254/1/SB%2018.pdf http://journalarticle.ukm.my/23254/ https://www.ukm.my/jsm/english_journals/vol52num11_2023/contentsVol52num11_2023.html |
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