Effect Of Indium Addition On Microstructure, Wettability, Shear Strength And Creep Behavior Of Sn100c Solder

Due to environmental concern of lead toxicity, the use of lead-free solder has been widely used in electronic packing industries. In finding alternative of lead-free solder to replace the current lead solder, the lead-free solder should have a melting point close to lead solder (183°C), has good wet...

Full description

Saved in:
Bibliographic Details
Main Author: Abdullah, Nabihah
Format: Thesis
Language:English
Published: 2019
Subjects:
Online Access:http://eprints.usm.my/46741/1/Effect%20Of%20Indium%20Addition%20On%20Microstructure%2C%20Wettability%2C%20Shear%20Strength%20And%20Creep%20Behavior%20Of%20Sn100c%20Solder.pdf
http://eprints.usm.my/46741/
Tags: Add Tag
No Tags, Be the first to tag this record!