IDVP (Intra-Die Variation Probe) for System-On-Chip (SoC) Infant Mortality Screen

• Main Authors: Abdul Latif, Mohd Azman, Zain Ali, Noohul Basheer, Hussin, Fawnizu Azmadi
• Format: Conference or Workshop Item
• Published: 2011
• Subjects: TK Electrical engineering. Electronics Nuclear engineering
• Online Access: http://eprints.utp.edu.my/6343/1/C1L-C-4-1285.pdf; http://ieeexplore.ieee.org/search/srchabstract.jsp?tp=&arnumber=5938001; http://eprints.utp.edu.my/6343/

Used materials, oxides thicknesses, and ultra-small channel lengths are contributors to the impact of well known reliability issue such as NBTI (Negative Bias Temperature Instability). This paper describes a case study using an Intra-Die Variation Probe (IDVP) test to screen out Infant Mortality (I...