RedSOCs‐3D: Thermal‐safe Test Scheduling for 3D‐Stacked SoC

• Main Authors: Hussin, Fawnizu Azmadi, Yu, Thomas Edison Chua, Yoneda, Tomokazu, Fujiwara, Hideo
• Format: Conference or Workshop Item
• Published: 2010
• Subjects: TK Electrical engineering. Electronics Nuclear engineering
• Online Access: http://eprints.utp.edu.my/3559/1/PID1329527_v1.0.pdf; http://www.apccas2010.org; http://eprints.utp.edu.my/3559/

This paper investigates the challenges of a 3D-stacked system-on-chip testing, especially in terms of thermal problem. It is known that test power can be more than twice the intended power dissipation of the chip in the functional mode, for a single die. This problem is exacerbated when more than on...