RedSOCs‐3D: Thermal‐safe Test Scheduling for 3D‐Stacked SoC
This paper investigates the challenges of a 3D-stacked system-on-chip testing, especially in terms of thermal problem. It is known that test power can be more than twice the intended power dissipation of the chip in the functional mode, for a single die. This problem is exacerbated when more than on...
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Main Authors: | , , , |
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Format: | Conference or Workshop Item |
Published: |
2010
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Subjects: | |
Online Access: | http://eprints.utp.edu.my/3559/1/PID1329527_v1.0.pdf http://www.apccas2010.org http://eprints.utp.edu.my/3559/ |
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