Effect of external stresses by bending on Sn whiskers formation and growth on immersion Sn surface finish

• Main Authors: Fadil, Nor Akmal, Yusof, Siti Zahira, A. B. Kahar, Mohamad Nawawi, Abu Bakar, TutyAsma
• Format: Conference or Workshop Item
• Published: 2015
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.utm.my/id/eprint/63451/; http://www.akademiabaru.com/conference.html

Deposited tin (Sn) layers used as lead-free solderable finish on the semiconductor devices are known to form whiskers. These whiskers are single crystal of tin that spontaneously grows from the surface of tin within weeks to years. Thus, they can cause shorts and the failure of a whole electronic ci...