The effect of alloying element in lead-free solders on intermetallics growth with enimag surface finish
Surface finish is coated layer plated on a bare copper board of printed circuit board (PCB). Among PCB surface finishes, Electroless Nickel/Immersion Gold (ENIG) finish is a top choice among electronic packaging manufacturer due to its excellent properties for PCB. However, the use of gold ele...
Saved in:
Main Author: | Jaidi, Zolhafizi |
---|---|
Format: | Thesis |
Language: | English English English |
Published: |
2020
|
Subjects: | |
Online Access: | http://eprints.uthm.edu.my/1161/1/24p%20ZOLHAFIZI%20JAIDI.pdf http://eprints.uthm.edu.my/1161/2/ZOLHAFIZI%20JAIDI%20COPYRIGHT%20DECLARATION.pdf http://eprints.uthm.edu.my/1161/3/ZOLHAFIZI%20JAIDI%20WATERMARK.pdf http://eprints.uthm.edu.my/1161/ |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Intermetallic compound layer growth at the Interface between Sn-Ag and ENImAg surface finish
by: Mohamed Anuar, Rabiatul Adawiyah, et al.
Published: (2020) -
Interfacial reaction between SAC305 lead–free solders and ENImAg surface finish and bare copper
by: M.A., Rabiatul Adawiyah, et al.
Published: (2017) -
Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model
by: Mohd. Yamin, Aliff Farhan
Published: (2012) -
Interfacial reaction between SAC305 and SAC405 lead-free solders and electroless nickel/immersion silver (ENImAg) surface finish
by: Mohamed Anuar, Rabiatul Adawiyah
Published: (2017) -
Effect of reflow soldering and isothermal aging on interfacial microstructure between lead-free solder alloy and different surface finishes
by: Tan, C. L., et al.
Published: (2006)